IC Package Tech Lead
Permanent
IC Package Tech Lead
France – Hybrid working
High competitive salary plus employee benefits
Job Description:
• Drive, in close collaboration with the assembly centers (in Europe and Asia) and with our design/R&D team, the specifications of the package of the ICs
• Participate with our IC design team to the definition and/or design of reliable Ball Grid Array package substrates, using specific electrical CAD tools
• Prepare the relevant documentation for BGA substrate design approval and substrate first procurement in accordance.
• Drive advanced package material selection through standard and innovative solutions to meet the total product package performance requirements across the product application domains
• Perform feasibility studies for early assessment of substrate technology and electrical performances
• Cooperate with assembly center R&D teams for continuous design performance improvement
• Drive and/or execute Mechanical, Thermal and Electrical Modeling in cooperation with the assembly partners
• Contribute to the integration of solutions in customers application on packaging related aspects and thermal dissipation system implementation
To be considered you will need the following:
• You have a MSc in Electrical Engineering or equivalent and 5+ years of hands-on experience in IC package definition, selection, and qualification.
• You have good knowledge of IC package assembly development process
• You have experience in high performance Flip-Chip BGA packaging type for large size, high-speed and high-power IC.
• You have experience in determining impact of packaging on PCB design, board and system integration including high speed digital and RF aspects
• You have experience in system level thermal dissipation technologies (through board, heat spreader, heat sink, fan…). Experience in thermal simulation is a plus.
• Team spirit, curiosity, flexibility, sense of commitment, high quality standards
• Good analytical and problem-solving skills
• Proven customer contact skills
• Fluent in English; French is a plus
• Experience in die-to-die interconnect Technologies is a plus.
• RF experience is a plus
• Knowhow on interconnection design tools is a plus
Please get in touch with Christina McGuire to hear more about this incredible position!
France – Hybrid working
High competitive salary plus employee benefits
Job Description:
• Drive, in close collaboration with the assembly centers (in Europe and Asia) and with our design/R&D team, the specifications of the package of the ICs
• Participate with our IC design team to the definition and/or design of reliable Ball Grid Array package substrates, using specific electrical CAD tools
• Prepare the relevant documentation for BGA substrate design approval and substrate first procurement in accordance.
• Drive advanced package material selection through standard and innovative solutions to meet the total product package performance requirements across the product application domains
• Perform feasibility studies for early assessment of substrate technology and electrical performances
• Cooperate with assembly center R&D teams for continuous design performance improvement
• Drive and/or execute Mechanical, Thermal and Electrical Modeling in cooperation with the assembly partners
• Contribute to the integration of solutions in customers application on packaging related aspects and thermal dissipation system implementation
To be considered you will need the following:
• You have a MSc in Electrical Engineering or equivalent and 5+ years of hands-on experience in IC package definition, selection, and qualification.
• You have good knowledge of IC package assembly development process
• You have experience in high performance Flip-Chip BGA packaging type for large size, high-speed and high-power IC.
• You have experience in determining impact of packaging on PCB design, board and system integration including high speed digital and RF aspects
• You have experience in system level thermal dissipation technologies (through board, heat spreader, heat sink, fan…). Experience in thermal simulation is a plus.
• Team spirit, curiosity, flexibility, sense of commitment, high quality standards
• Good analytical and problem-solving skills
• Proven customer contact skills
• Fluent in English; French is a plus
• Experience in die-to-die interconnect Technologies is a plus.
• RF experience is a plus
• Knowhow on interconnection design tools is a plus
Please get in touch with Christina McGuire to hear more about this incredible position!
19003TD9
France
| Post-Silicon / Manufacturing / Process: | IC Packaging |
T : +44 1628 206 215
E : semiconductors@microTECH-global.com
E : semiconductors@microTECH-global.com
